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Accurate Characterization of Package and Board Components for Efficient System Level Signal Integrity Analysis

机译:用于高效系统级信号完整性分析的包装和板组件的精确表征

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In order to prevent or minimize signal integrity (SI) and electromagnetic compatibility (EMC) problems in high-speed microelectronic systems, efficient system-level analyses must be carried out at the pre-layout stage, so as to develop reliable design measures. For these analyses, an accurate characterization of package and board components is required to extract realistic circuit models within the frequency range of interest. In this contribution, novel techniques for the extraction of such models are presented.
机译:为了防止或最小化信号完整性(Si)和电磁兼容性(EMC)在高速微电子系统中的问题,必须在预布局阶段进行高效的系统级别分析,以开发可靠的设计措施。对于这些分析,需要精确表征封装和板组件,以提取频率范围内的逼真电路模型。在这种贡献中,提出了用于提取这种模型的新技术。

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