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Hydrogenated amorphous silicon sensors based on thin film on ASIC technology

机译:基于ASIC技术的基于薄膜的氢化非晶硅传感器

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The performance and limitations of a novel detector technology based on the deposition of a thin-film sensor on top of processed integrated circuits have been studied. Hydrogenated amorphous silicon (a-Si:H) films have been deposited on top of CMOS circuits developed for these studies and the resulting "thin-film on ASIC" (TFA) detectors are presented. The leakage current of the a-Si:H sensor at high reverse biases turns out to be an important parameter limiting the performance of a TFA detector. Its detailed study and the pixel segmentation of the detector are presented. High internal electric fields (in the order of 10/sup 4/-10/sup 5/ V/cm) can be built in the a-Si:H sensor and overcome the low mobility of electrons and holes in a-Si:H. Signal induction by generated carrier motion and speed in the a-Si:H sensor have been studied with a 660 nm pulsed laser on a TFA detector based on an ASIC integrating 5 ns peaking time pre-amplifiers. The measurement set-up also permits to study the depletion of the sensor and results are presented. Finally, direct detection of 5.9 keV X-rays with TFA detectors based on an ASIC integrating low noise pre-amplifiers (27 e/sup -/ r.m.s.) are shown.
机译:已经研究了基于薄膜传感器在已处理集成电路顶部的沉积的新型检测器技术的性能和局限性。氢化非晶硅(a-Si:H)膜已沉积在为这些研究而开发的CMOS电路顶部,并介绍了所得的“ ASIC上的薄膜”(TFA)检测器。事实证明,在高反向偏置下,a-Si:H传感器的泄漏电流是限制TFA检测器性能的重要参数。对其进行了详细的研究和检测器的像素分割。可以在a-Si:H传感器中建立高内部电场(大约10 / sup 4 / -10 / sup 5 / V / cm),并克服了a-Si:H中电子和空穴的低迁移率。在集成了5 ns峰值时间前置放大器的ASIC的基础上,利用TFA检测器上的660 nm脉冲激光器研究了由a-Si:H传感器中产生的载流子运动和速度引起的信号感应。测量设置还可以研究传感器的损耗,并给出结果。最后,显示了基于集成了低噪声前置放大器(27 e / sup-/ r.m.s.)的ASIC的TFA检测器对5.9 keV X射线的直接检测。

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