tin alloys; silver alloys; copper alloys; ball grid arrays; plastic packaging; printed circuits; solders; fatigue testing; failure analysis; plastic deformation; thermal expansion; microassembling; circuit reliability; bending; finite element analysis; PBGA assemblies; lead-free solder; halogen-free PCB; environmental legislations; electronics manufacture; solders material; SnPb solder alloy; SnAgCu alloys; assembly reliability; impact loading; thermal expansion coefficient; plastic ball grid array assemblies; halogen free laminate substrates; fatigue life; finite element model; PCB strains; solder joint plastic strains; mechanical fatigue reliability; tin-lead solder/FR4 substrates; lead-free solder/FR4 substrates; tin-lead solder/halogenfree substrates; lead-free solder/halogen free substrates; SnAgCu;
机译:无铅和无卤PBGA组件的机械弯曲疲劳可靠性
机译:评估使用无铅焊料的PBGA组件的板级焊点可靠性
机译:SnAgCu焊料在FR-4 PCB上PBGA封装的组装和可靠性
机译:PBGA组件与无铅焊料和无卤素PCB的机械疲劳可靠性
机译:使用无铅焊接材料,无卤素层压板材料以及纳米材料的表面光洁度进行电子组装,返工和可靠性评估。
机译:电子设备中无铅焊点的可靠性问题
机译:芯片组件无铅焊点的疲劳寿命散射(<特殊问题>电子设备和机械工程的热电机械可靠性)