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Investigation of the hermeticity of bcb-sealed cavities for housing (rf-)mems devices

机译：用于外壳（rf-）记忆体设备的bcb密封腔的气密性研究

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《》|2002年|P.677-680|共4页
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Jourdain; A.; De Moor; P.; Pamidighantam; S.;
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中图分类无线电电子学、电信技术;
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1. Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices [J] . Jourdain A, De Moor P, Baert K, Journal of Micromechanics and Microengineering . 2005,第7期

机译：BCB的机械和电气特性，用作腔体（RF-）MEMS器件的粘合和密封材料
2. A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process [J] . Torunbalci Mustafa Mert, Alper Said Emre, Akin Tayfun Journal of Micromechanics and Microengineering . 2015,第12期

机译：一种使用先进的MEMS工艺对具有嵌入式垂直馈通的SOI-MEMS器件进行晶圆级气密封装的方法
3. Advanced MEMS Process for Wafer Level Hermetic Encapsulation of MEMS Devices Using SOI Cap Wafers With Vertical Feedthroughs [J] . Torunbalci Mustafa Mert, Alper Said Emre, Akin Tayfun Microelectromechanical Systems, Journal of . 2015,第3期

机译：使用具有垂直馈通的SOI盖晶片的MEMS晶片级气密封装的先进MEMS工艺
4. Investigation of the hermeticity of BCB-sealed cavities for housing (RF) MEMS devices [C] . A. Jourdain, P. De Moor, S. Pamidighantam, IEEE International Conference on Micro Electro Mechanical Systems . 2002

机译：对外壳（RF）MEMS器件的BCB密封空腔的密封性的研究
5. Low temperature hermetically sealed three-dimensional MEMS device for wireless optical communication [D] . Agarwal, Rahul 2007

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6. Packaging and Non-Hermetic Encapsulation Technology for Flip Chip on Implantable MEMS Devices [O] . Jemmy Sutanto, Sindhu Anand, Arati Sridharan, -1

机译：包装和非气密封装技术适用于植入式mEms器件倒装芯片
7. Investigation on Hermeticity of Liquid Crystal Polymer Package for MEMS Based Safety Device [O] . Jinnil Choi, Yong-Kook Kim, Byeong-Kwon Ju 2015

机译：基于MEMS的安全装置液晶聚合物包装的密闭性研究
8. Aerospace Sensor Component and Subsystem Investigation and Innovation-2 Component Exploration and Development (ASCSII-2 CED) Delivery Order 0003: Hermetically Sealed Cavities in 3-D GaAs-Silicon and Silicon-Silicon Packages for Microelectromechanical System (MEMS) Devices Using Selective and Large-Scale Bonding [R] . Malshe, A. P. 2003

机译：航空航天传感器组件和子系统调查与创新-2组件探索与开发（asCsII-2 CED）交付订单0003：采用选择性和大型的微机电系统（mEms）器件的三维Gaas硅和硅硅封装的气密密封腔 - 规模粘合

Investigation of the hermeticity of bcb-sealed cavities for housing (rf-)mems devices

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