Thickness and density measurement for new materials with combined X-ray technique

摘要

An X-ray metrology tool with functions of X-ray reflectometry (XRR), X-ray fluorescence (XRF) and X-ray diffraction (XRD) has been developed. Film thicknesses can be determined using XRR, XRF or XRD. Method selection criteria are discussed here. Film density is determined using XRR, film composition is determined using XRF, and crystal orientation is determined using XRD. Combined tools are developed to give maximum speed for major IC metrology applications.