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X-RAY PLATE THICKNESS MEASUREMENT METHOD AND X-RAY PLATE THICKNESS MEASUREMENT INSTRUMENT

机译:X射线板厚度测量方法及X射线板厚度测量仪器

摘要

PROBLEM TO BE SOLVED: To provide an X-ray plate thickness measurement method and an X-ray plate thickness measurement instrument which measure plate thickness by using a laminography method to generate image data for allowing fast and accurate measurement of respective thicknesses of overlapping plate members in an X-ray irradiation direction, in order to cope with issues of plate thickness inspection of a large-sized structure.;SOLUTION: The X-ray plate thickness measurement method has a function of alternately arranging a photographing position in a backward translation path and a photographing position in a forward translation path when photographing X-ray transmission data in the forward translation path and the backward translation path for scanning, whereby plate thickness can be measured by using a laminography method to generate image data for allowing fast and accurate measurement of respective thicknesses of overlapping plate members in an X-ray irradiation direction, in order to cope with issues of plate thickness inspection of a large-sized structure.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种X射线板厚度测量方法和X射线板厚度测量仪器,其通过使用放射线照相法来测量板厚度以生成图像数据,以允许快速且准确地测量重叠的板构件的各个厚度。为了解决大型结构的板厚检查问题,在X射线照射方向上进行了解决。解决方案:X射线板厚测量方法具有在向后平移路径中交替布置拍摄位置的功能。当在正向平移路径和向后平移路径中拍摄X射线透射数据以进行扫描时,通过在正向平移路径中的拍摄位置进行拍摄,从而可以通过层照相术来测量板厚以生成图像数据,从而可以进行快速而准确的测量X射线照射方向上重叠板件的相应厚度的单位r用于解决大型结构的板厚检查问题。;版权所有:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP2014025813A

    专利类型

  • 公开/公告日2014-02-06

    原文格式PDF

  • 申请/专利权人 HITACHI LTD;

    申请/专利号JP20120166482

  • 申请日2012-07-27

  • 分类号G01B15/02;

  • 国家 JP

  • 入库时间 2022-08-21 16:15:09

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