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Beneath-The-Channel Strain-Transfer-Structure (STS) and Embedded Source/Drain Stressors for Strain and Performance Enhancement of Nanoscale MOSFETs

机译:在沟道下方的应变传递结构(STS)和嵌入式源极/漏极应力源,用于纳米级MOSFET的应变和性能增强

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We report the first demonstration of a novel transistor structure featuring a beneath-the-channel strain-transfer-structure (STS) and embedded source/drain (S/D) stressors for strain and performance enhancement. As compared to a transistor with standard S/D stressors, additional strain is imparted to the channel region by the STS due to coupling of its lattice interactions with the adjacent S/D stressors and the overlying channel region. Both strained n-FET with SiGe STS and silicon-carbon (SiC) S/D, and strained p-FET with SiC STS and SiGe S/D, were realized. The Ion performance of strained n- and p-FETs with STS and S/D stressors were enhanced by 42% and 60%, respectively, over unstrained control transistors for given DIBL of 0.15 V/V.
机译:我们报告了一种新颖的晶体管结构的首次演示,该晶体管结构具有沟道下方的应变传递结构(STS)和嵌入式源极/漏极(S / D)应力源,可提高应变和性能。与具有标准S / D应力源的晶体管相比,由于其晶格相互作用与相邻的S / D应力源和上覆沟道区的耦合,STS会向沟道区施加额外的应变。既实现了带有SiGe STS和硅碳(SiC)S / D的应变n-FET,又实现了带有SiC STS和SiGe S / D的应变p-FET。对于给定的0.15 V / V的DIBL,具有STS和S / D应力源的应变n-FET和p-FET的I on 性能分别比未应变的控制晶体管提高了42%和60%。

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