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High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture

机译:使用Si:C和SiGe外延源极/漏极的高性能应力增强MOSFET及其制造方法

摘要

A semiconductor device and method of manufacturing a semiconductor device. The semiconductor device includes channels for a pFET and an nFET. A SiGe layer is selectively grown in the source and drain regions of the pFET channel and a Si:C layer is selectively grown in source and drain regions of the nFET channel. The SiGe and Si:C layer match a lattice network of the underlying Si layer to create a stress component. In one implementation, this causes a compressive component in the pFET channel and a tensile component in the nFET channel.
机译:半导体器件及其制造方法。该半导体器件包括用于pFET和nFET的沟道。在pFET沟道的源极和漏极区域中选择性地生长SiGe层,并且在nFET沟道的源极和漏极区域中选择性地生长Si:C层。 SiGe和Si:C层与下面的Si层的晶格网络匹配,以创建应力分量。在一种实施方式中,这在pFET沟道中引起压缩分量而在nFET沟道中引起拉伸分量。

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