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A comparative device and performance analysis between a Si-Ge epitaxial-base HBT and a Si double-poly I/I BJT npn structure

机译:Si-Ge外延基HBT与Si双多晶硅I / I BJT npn结构的比较器件及性能分析

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The device characteristics and performance leverage of a SiGe epitaxial-base heterojunction bipolar transistor (HBT) are compared to those of an advanced Si double-poly ion-implanted (I/I)-base bipolar junction transistor (BJT) npn structure. In addition, a collector-base profile optimization for the SiGe device structure is described. Two-dimensional numerical process and device simulators and a lumped equivalent circuit model generator are used for the comparison along with experimental data. The simulated results show a greater than 3* increase in current gain, a 1.5* increase in the unity-gain cutoff frequency, and a 13% improvement in ECL circuit delay for the SiGe device. The experimental results confirm the device behavior predicted by the simulations.
机译:将SiGe外延基异质结双极晶体管(HBT)的器件特性和性能杠杆与先进的Si双聚离子注入(I / I)基双极结晶体管(BJT)npn结构的器件特性和性能杠杆进行了比较。另外,描述了用于SiGe器件结构的基于集电极的轮廓优化。二维数值过程和设备仿真器以及集总等效电路模型生成器与实验数据一起用于比较。仿真结果表明,SiGe器件的电流增益提高了3倍以上,单位增益截止频率提高了1.5倍,ECL电路延迟提高了13%。实验结果证实了仿真预测的器件性能。

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