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Indium phosphide-based materials and heterostructure devices, and their applications in monolithic integrated NPN and PNP HBT circuits.

机译:基于磷化铟的材料和异质结构器件及其在单片集成NPN和PNP HBT电路中的应用。

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摘要

InP-based materials were grown by MOCVD. Carbon was used as p-type dopant for InGaAs. Growth conditions and material characteristics were studied. These layers were then used to grow InP-based Heterojunction Bipolar Transistors (HBTs). Device results were verified through material characterization techniques such as carrier lifetime measurements.; InP-based HBTs were then fabricated using a in-house developed processing technology which highlights a self-aligned base and a lateral-undercut-collector technique. First, HBTs employing InP material as emitter layers have been studied. State-of-art performance has been demonstrated using both zinc and carbon as base dopants for InP/InGaAs HBTs.; HBTs employing InAlAs material as emitter layers were then studied. Low-doped and thicker collector design features have been used to improve the power performance of Single Heterojunction Bipolar Transistors (SHBTs). High breakdown voltage as well as excellent power characteristics, including a record performance in terms of output power density has been obtained for these devices.; Microwave Monolithic Integrated Circuits (MMICs) were then designed, fabricated and measured using the developed InP-based NPN HBTs technology. A wide bandwidth amplifier at low DC power consumption has been demonstrated. A “tree” topology design for X-band power amplifiers has been realized and the performance of such amplifiers was measured and compared with that of conventional power amplifiers. Moreover, low-phase noise oscillators were demonstrated at Ka-band.; InP-based complementary HBT technology was developed. A selective MBE regrowth approach has been employed to achieve the planarized NPN and PNP HBT structure. A merged processing technique was developed to monolithically integrate these two types of devices on the same chip. Fabricated complementary (NPN+PNP) devices demonstrated state-of-art performance, compared with that of discrete HBTs.; The developed complementary technology was applied to demonstrate Microwave Monolithic Integrated Circuits (MMICs). Various types of push-pull amplifiers have been designed, fabricated and characterized. Improved power performance as well as linearity and efficiency have been observed. HBT amplifiers with PNP HBT active loads were realized. High voltage gain with low power supply voltage operation has been observed. These circuits demonstrate great potential for the developed complementary HBT technology in high-linearity, low power and high efficiency applications.
机译:通过MOCVD生长基于InP的材料。碳用作InGaAs的p型掺杂剂。研究了生长条件和材料特性。然后将这些层用于生长基于InP的异质结双极晶体管(HBT)。通过材料表征技术(例如载流子寿命测量)验证了器件结果。然后,使用内部开发的加工技术制造基于InP的HBT,该技术突出了自对准基座和侧向咬边收集器技术。首先,已经研究了采用InP材料作为发射极层的HBT。使用锌和碳作为InP / InGaAs HBT的基本掺杂剂,已经证明了最新的性能。然后研究了采用InAlAs材料作为发射极层的HBT。低掺杂和较厚的集电极设计特性已用于改善单异质结双极晶体管(SHBT)的功率性能。这些器件已获得高击穿电压以及出色的功率特性,包括在输出功率密度方面的创纪录性能。然后使用已开发的基于InP的NPN HBTs技术设计,制造和测量微波单片集成电路(MMIC)。已经证明了低直流功耗下的宽带放大器。已经实现了用于X波段功率放大器的“树形”拓扑设计,并且测量了这种放大器的性能并将其与常规功率放大器进行了比较。此外,在Ka波段演示了低相位噪声振荡器。开发了基于InP的互补HBT技术。已采用选择性MBE再生方法来实现平面化的NPN和PNP HBT结构。开发了一种合并处理技术,以将这两种类型的设备单片集成在同一芯片上。与分立的HBT相比,制造的互补(NPN + PNP)器件具有最先进的性能。开发的互补技术被用于演示微波单片集成电路(MMIC)。已经设计,制造和表征了各种类型的推挽放大器。已经观察到改善的功率性能以及线性和效率。实现了具有PNP HBT有源负载的HBT放大器。已经观察到低电源电压下的高电压增益。这些电路为开发的互补HBT技术在高线性度,低功耗和高效率应用中展示了巨大的潜力。

著录项

  • 作者

    Cui, Delong.;

  • 作者单位

    University of Michigan.;

  • 授予单位 University of Michigan.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2001
  • 页码 300 p.
  • 总页数 300
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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