IBM Microelectronics, Hopewell Junction, NY 12533;
IBM Microelectronics, Hopewell Junction, NY 12533;
IBM Microelectronics, Hopewell Junction, NY 12533;
IBM Microelectronics, Hopewell Junction, NY 12533;
IBM Microelectronics, Essex Junction, VT 05452;
IBM Microelectronics, Essex Junction, VT 05452;
IBM Microelectronics, Essex Junction, VT 05452;
IBM Microelectronics, Essex Junction, VT 05452;
IBM Microelectronics, Hopewell Junction, NY 12533;
IBM Microelectronics, Hopewell Junction, NY 12533;
IBM Microelectronics, Hopewell Junction, NY 12533;
机译:具有原位蚀刻表面修饰的等离子蚀刻技术,可实现高度可靠的低k / Cu双镶嵌互连
机译:有效的铜表面预处理,用于具有高耐等离子体性的超低介电常数(k = 2.2)的高可靠性22 nm节点铜双镶嵌互连
机译:用于高度可靠的超大规模集成互连的Cu(Sn)合金沉积工艺设计
机译:32NM节点高度可靠的CU / LOW-K集成技术,CUMN合金种子
机译:高度稳定的非晶硅薄膜晶体管及其在透明塑料上可靠的有机发光二极管显示器的集成方法。
机译:充氮多孔低k SiOCH / Mn2O3-xN / Cu集成体的电学特性和可靠性
机译:Co层在顺磁性CuMn稀合金中Cu和Mn原子的自旋极化和交换耦合