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Defect-free IDDQ with reverse body bias

机译:无缺陷IDDQ,反向身体偏置

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Abstract: Systematic investigations on defect-free IDDQ in deep sub- micron CMOS with reverse body bias were performed by SPICE simulation to improve resolution of IDDQ measurement. Effects of reverse body bias on off-state leakage of scaled CMOS devices and IDDQ of typical CMOS circuit cells were investigated. It was found that reverse body bias could effectively reduce worst case defect-free IDDQ of typical circuit cells by more than one order in magnitude for technology generation down to 0.18 micrometer. The reduction in worse case defect-free IDDQ is enhanced as the device temperature goes up and diminished as the temperature goes down. Further investigation showed that reverse body bias also made the defect-free IDDQ less sensitive to the input state; therefore one single IDDQ current threshold might still be used for IDDQ testing down to 0.18 micrometer technology generation. It was found that there might exist an optimal reverse body bias that minimizes the defect-free IDDQ current. The optimal reverse bias value decreases as the temperature goes down and might vary from circuit to circuit, process to process, and technology generation to generation. !9
机译:摘要:通过SPICE仿真系统研究了深亚微米CMOS中具有反向体偏置的无缺陷IDDQ,以提高IDDQ测量的分辨率。研究了反向本体偏置对按比例缩放的CMOS器件的关态泄漏和典型CMOS电路单元的IDDQ的影响。已经发现,反向本体偏置可以有效地将典型电路单元的最坏情况下无缺陷的IDDQ降低一个数量级以上,从而使工艺产生的尺寸降至0.18微米。随着器件温度的升高,无缺陷IDDQ的最坏情况的降低得到增强,而温度降低,IDDQ的缺陷则减少。进一步的研究表明,反向的车身偏置也使无缺陷的IDDQ对输入状态的敏感性降低。因此,一个IDDQ电流阈值可能仍可用于IDDQ测试,直到0.18微米技术时代。已经发现,可能存在最佳的反向主体偏置,该偏置可使无缺陷IDDQ电流最小化。最佳反向偏置值随温度降低而降低,并且可能因电路,工艺和工艺的不同而变化。 !9

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