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Compact and simple ESPI devices for testing of materials and components in microelectronic manufacturing

机译:紧凑,简单的ESPI设备,用于测试微电子制造中的材料和组件

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Abstract: With the increasing packaging density of electronic components in the integrated circuits (IC) as well as on the printed circuit boards the problems with heat dissipation also increase. Electronic speckle pattern interferometry (ESPI) is a rapidly developing optoelectronic method of nondestructive laser metrology supported with computer evaluations. It permits measurements of deformations in the micrometer and submicrometer ranges produced by an electrical signal, heating, mechanical stress or another load. Though these method seems very friendly for testing microelectronic components, composite materials, miniature devices, circuit boards, wafers etc., it has several drawbacks which prevent its application in real industrial environment: complexity, bulkiness and high costs of optical setups, difficulties in aligning of the optical elements. There are problems in working outside the laboratory especially due to high sensitivity of ESPI devices against environmental vibrations and daylight. We present several methods ESPI based on which a family of devices was built. Their unique properties permit to avoid all drawbacks mentioned above. These devices are extremely simple and compact. They are easily aligned and operated even by persons who are not skilled in optics. These devices are ideally suited for working outside the laboratory even by persons who are not skilled in optics. These devices are ideally suited for working outside the laboratory for example in a well-lit industrial environment. The innovative devices permit to measure deformations both in the plane of the object surface and perpendicular to it. A detailed description of the methods and devices given. Multiple examples of ESPI computer evaluations obtained in the novel devices with different small objects under test are presented. However these devices permit to work with much bigger objects if required. Our methods and devices are also suited for qualitative as well as quantitative analysis. !16
机译:摘要:随着集成电路(IC)以及印刷电路板上电子组件封装密度的提高,散热问题也越来越多。电子散斑图案干涉法(ESPI)是一种快速发展的无损激光计量光电方法,并得到了计算机评估的支持。它允许测量由电信号,加热,机械应力或其他负载产生的微米和亚微米范围内的变形。尽管这些方法似乎对测试微电子元件,复合材料,微型器件,电路板,晶片等非常友好,但它仍然存在一些缺点,使其无法在实际的工业环境中使用:复杂,体积大,光学装置成本高,对准困难光学元件。特别是由于ESPI设备对环境振动和日光的敏感性较高,因此在实验室外工作时会出现问题。我们介绍了几种基于ESPI的方法,基于这些方法可以构建一系列的设备。它们独特的性能可以避免上述所有缺点。这些设备非常简单和紧凑。即使不熟悉光学的人员也可以轻松对准和操作它们。这些设备非常适合光学实验室不熟练的人员在实验室外工作。这些设备非常适合在实验室外(例如在光线充足的工业环境中)工作。创新的设备可以测量物体表面的平面和垂直于物体表面的变形。给出的方法和设备的详细说明。给出了在带有不同小物体的新型设备中获得的ESPI计算机评估的多个示例。但是,如果需要,这些设备可用于更大的物体。我们的方法和设备也适用于定性和定量分析。 !16

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