HAND PLACING LEADLESS AND FINE PITCH LEADED COMPONENTS WITH SIPAD SOLID SOLDER DEPOSITION

摘要

As the electronics industry continues to evolve and change,rncompanies are being forced to adapt to maintain theirrncurrent business, while attempting to develop newrncustomers. Adaptation comes in different forms. It could berna larger building, a new piece of equipment, or a shift inrnphilosophy, but the bottom line is, sometimes successrndepends on “a new order of things”.rnIn the manufacturing of surface mount electronics, much hasrnchanged over the last 10 years. Components that werernconsidered leading edge in 1993 don’t even exist any more.rnDevices 1/10 the size with 10 x the horsepower havernbecome common place. Ultimately the new devices mayrnmeet the same fate as “the new order” evolves.rnHow can CEM’s and OEM’s keep up with the everrnchanging requirements demanded by their companies orrncustomers? It is easy to throw money at a problem, buyingrnbetter, more capable equipment to manufacture and verifyrnyour assemblies but in a time when money is tight andrnbusiness slow, is that an option? Does your budget for 2003rninclude an x-ray machine, new stencil printer or morernsophisticated chip shooter?rnEven if it does, will you be able to purchase this newrnequipment, get people trained on it, and pay for it while thernindustry is in a slump? Maybe? Maybe not.rnA shrewd planner must be an innovator. Some call them arnMacGyver. A company has to have a person that sortsrnthrough the sales pitches to find true innovation. Things thatrnwork better than the “old conditions” they are used to. Evenrnif a company has an innovator, he or she may have to battlern“enemies, all those who have done well under the oldrnconditions”. They may be co-workers, bosses, or even salesrnpeople offering advice based on selling their product versusrnsolving your challenges.rnSolid solder deposit has been around for 16 years, in thernUnited States for 5 years. Some in our industry have evenrncalled it the “greatest idea that no body has ever heard of”.rnSSD has proven successful as a “new order of things” forrnmore than 50 companies that know about it and have sentrntheir own innovators to the shop floor to see if it works. Yesrnyou can place BGA and flip chip components. Yes you canrnhand place .4mm QFP, 0402, 0201 components. Rigidrnboards, flex cables, thin boards, thick boards, lead free, highrntemp, low temp. Assemblies that are cleaner, higher quality,rnand have better throughput than those produced byrntraditional hand paste and place methods.rnThis paper will explore solid solder deposition for BGA,rnLLP, and fine pitch leaded parts. Who is using SSD, howrnthey are using it, and how it can be used by companies thatrnare willing to consider the “new order of things” as anrnimmediate, affordable, and easy to implement pathway tornsuccess.