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HAND TOOL TOR INSTALLING SOLDER FORMS OVER COMPONENT LEADS

机译：手工工具在组件引线上安装焊料表格

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摘要

For abstract, see NSA 26 15, number 36000.

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作者
D. W. Bowlen;
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作者单位

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年度 1972
页码 1-27
总页数 27
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Circuits; Equipment and procedures; Soldering;

机译：电路;设备和程序;焊接;

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专利

1. Lead-free hand soldering through hole components [J] . Bob Willis Global SMT & Packaging: European Edition (Surface Mount Technology) . 2004,第6期

机译：无铅手焊通孔组件
2. Characterization of mechanical performance of Sn/Ag/Cu solders joints with different component lead coatings [J] . Minna Arra, Todd Castello, Dongkai Shangguan, Soldering & Surface Mount Technology . 2004,第1期

机译：具有不同成分铅涂层的Sn / Ag / Cu焊点的机械性能表征
3. Tools to assure compatibility of conformal coatings and no-clean lead-free solder pastes [J] . Emmanuelle Guene, Celine Puechagut Global SMT & Packaging: European Edition (Surface Mount Technology) . 2013,第10期

机译：确保保形涂层和免清洗无铅焊膏兼容的工具
4. HAND SOLDER REWORK OF LEAD-FREE THROUGH-HOLECOMPONENTS LEADED SURFACE MOUNT PACKAGES [C] . Alan Donaldson The industry's best technical conference on electronic assembly and advanced packaging . 2005

机译：无铅通孔组件和带铅表面贴装的手工焊工返修
5. Harmonic vibration testing of electronic components attached to printed wiring boards with SAC305 and eutectic tin-lead solder. [D] . Paquette, Beth Miller. 2010

机译：使用SAC305和共晶锡铅焊料对附接到印刷线路板上的电子组件进行谐波振动测试。
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. Soldered joints on leaded components : development of a design tool to predict failure during temperature cycle tests [O] . Wolbert, PMM Peter, Brombacher, AC Aarnout 1996

机译：含铅部件上的焊接点：开发一种设计工具来预测温度循环测试期间的故障

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