首页> 外文会议>International Symposium on Ultra Clean Processing of Silicon Surfaces(UCPSS); 20060918-20; Antwerp(BE) >Interaction forces between oxide and silica-modified terpolymer abrasives and their impact on CMP and post-CMP
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Interaction forces between oxide and silica-modified terpolymer abrasives and their impact on CMP and post-CMP

机译:氧化物和二氧化硅改性的三元共聚物磨料之间的相互作用力及其对CMP和CMP后的影响

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Colloidal AFM was used to perform adhesion force measurements between a silica surface and polymer and silica-modified composite abrasives in DIW and buffer solutions at pH 4 and 10. We found that the pull-off forces for all the particles increase with decreasing pH. This effect is more evident in the case of the polymer colloids that are positively charged for pH below neutrality due to the presence of surface amino groups. The post-CMP particle removal efficiency after brush scrubbing in dilute ammonia is lower for the polymer particles. The relative density of the polymer particles on the oxide surface after CMP decreases with increasing pH. Furthermore, in the buffer solution at pF 10 we observe the highest RR due to the higher dissolution rate of the silica in alkaline pH.
机译:胶体原子力显微镜用于在pH为4和10的DIW和缓冲溶液中测量二氧化硅表面与聚合物和二氧化硅改性的复合磨料之间的粘附力。我们发现,随着pH的降低,所有颗粒的拉力均会增加。在由于表面氨基的存在而使pH低于中性的pH带正电的聚合物胶体的情况下,这种效果更加明显。对于聚合物颗粒,在稀氨水中进行刷洗后,CMP后的颗粒去除效率较低。 CMP后,氧化物表面上聚合物颗粒的相对密度随pH值的增加而降低。此外,在pF 10的缓冲溶液中,由于二氧化硅在碱性pH值下的较高溶解速率,我们观察到最高的RR。

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