EVALUATION AND CONTROL METHOD OF ORGANIC CONTAMINATION ON WAFER SURFACES

摘要

Organic contamination on wafers can be reduced by at least 50% by storing the wafers in a local space isolated from the clean room atmosphere. However, some components of the local space might cause wafer contamination due to degassing. It is thus necessary to select components with less degassing and to adopt a suitable method for component evaluation. A component evaluation method using the wafer as adsorbent will be introduced below. Unlike conventional analyses such as head space method and solvent eluation, this method is advantageous in that it detects the contaminants on the wafer only.