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Evaluation and control method of organic contamination on wafer surfaces

机译:晶片表面有机污染物的评估与控制方法

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Organic contamination on wafers can be reduced by at least 50% by storing the wafers in a local space isolated from the clean room atmosphere. However, some components of the local space might cause wafer contamination due to degassing. It is thus necessary to select components with less degassing and to adopt a suitable method for component evaluation. A component evaluation method using the wafer as adsorbent is introduced, which is advantageous in that it detects the contaminants on the wafer only.
机译:通过将晶片存放在与洁净室大气隔离的局部空间中,可以将晶片上的有机污染物减少至少50%。但是,局部空间的某些组件可能会因脱气而导致晶圆污染。因此,必须选择脱气较少的组件,并采用合适的方法进行组件评估。引入了使用晶片作为吸附剂的成分评估方法,该方法的优点在于,它仅检测晶片上的污染物。

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