Characterization of Room Temperature Solder Joints Using Scanning Acoustic Microscopy

摘要

NanoBond~® technology enables room temperature solder bond of materials without exposing the components to reflow temperatures. We present thermal performance and reliability results from direct solder attach of a silicon die to a copper spreader using this NanoBond~® technology. The use of Scanning Acoustic Microscopy to characterize this complex interface non-destructively and to drive process improvements is alsopresented in this paper.