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TCAD Optimisation of 4H-SiC Channel-Doped MOSFET with P-Polysilicon Gate

机译:具有P多晶硅栅极的4H-SiC沟道掺杂MOSFET的TCAD优化

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摘要

Although channel doping is a useful technique for improving the channel mobility of MOSFETs, channel doped MOSFETs display a trade-off between the channel mobility and the threshold voltage. One way to alleviate this compromise is to employ a gate material with a higher work function. In this paper the use of p-type polysilicon gate material, which has a 0.9V higher work-function than those of aluminum and n-type polysilicon, is suggested. TCAD simulations are employed to optimize the doping level and depth of the doped channel layer and to compare the various gate materials. The model for MOSFET channel mobility is enhanced through use of an explicitly defined distribution of surface charge trapping states within the band-gap. This allows good agreement with experimental data to be obtained over a wide range of gate voltage. An improvement of 50cm~2/Vs in the effective channel mobility is realized by using a p-polysilicon gate.
机译:尽管沟道掺杂是用于改善MOSFET沟道迁移率的有用技术,但是沟道掺杂MOSFET在沟道迁移率和阈值电压之间显示了一种折衷方案。减轻这种折衷的一种方法是采用具有较高功函的栅极材料。在本文中,建议使用功函数比铝和n型多晶硅高0.9V的p型多晶硅栅极材料。采用TCAD仿真来优化掺杂沟道层的掺杂水平和深度,并比较各种栅极材料。通过使用在带隙内明确定义的表面电荷俘获状态分布,可以增强MOSFET沟道迁移率模型。这样可以在很宽的栅极电压范围内获得与实验数据的良好一致性。通过使用p型多晶硅栅极,可将有效沟道迁移率提高50cm〜2 / Vs。

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