首页> 外文会议>International Conference on Silicon Carbide and Related Materials 2001 Pt.2 Oct 28-Nov 2, 2001 Tsukuba, Japan >Improved Channel Mobility in Normally-Off 4H-SiC MOSFETs with Buried Channel Structure
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Improved Channel Mobility in Normally-Off 4H-SiC MOSFETs with Buried Channel Structure

机译:具有埋入式沟道结构的常关4H-SiC MOSFET的沟道迁移率得到改善

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This paper presents that the channel mobility of 4H-SiC MOSFETs is significantly improved using the buried channel (BC) structure. The BC region was formed by nitrogen ion implantation at room temperature and following rapid thermal annealing. The effects of the depth of BC region and the thermal oxidation condition of the gate oxide on the channel mobility and threshold voltage were investigated. With the nitrogen concentration of 1x10~(17) cm~(-3), the optimal depth of the BC region was found to be 0.2 μm. When the gate oxide was grown by dry oxidation and following wet re-oxidation, the channel mobility of 140 cm~2/Vs was achieved in the normally-off 4H-SiC BC MOSFET. This channel mobility is the highest reported for a normally-off MOSFET with a thermally grown gate oxide formed on 4H-SiC (0001) wafer.
机译:本文表明,使用掩埋沟道(BC)结构可显着提高4H-SiC MOSFET的沟道迁移率。 BC区是通过在室温和快速热退火后通过氮离子注入形成的。研究了BC区深度和栅氧化层的热氧化条件对沟道迁移率和阈值电压的影响。在氮浓度为1x10〜(17)cm〜(-3)的情况下,BC区的最佳深度为0.2μm。通过干法氧化和湿法再氧化生长栅氧化物时,在常关型4H-SiC BC MOSFET中,沟道迁移率达到140 cm〜2 / Vs。对于在4H-SiC(0001)晶圆上形成有热生长栅极氧化物的常关MOSFET,该沟道迁移率是最高的。

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