公开/公告号US10062704B2
专利类型
公开/公告日2018-08-28
原文格式PDF
申请/专利权人 SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION;SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION;
申请/专利号US201615394592
申请日2016-12-29
分类号H01L21/8234;H01L27/11531;H01L21/265;H01L21/266;H01L21/3213;H01L21/762;H01L21/8238;H01L27/092;H01L27/11524;H01L29/04;H01L29/06;H01L29/08;H01L29/10;H01L29/16;H01L29/161;H01L29/167;H01L29/66;
国家 US
入库时间 2022-08-21 13:02:58