A Quantum Leap in Semiconductor Package Design

摘要

Over the years Fairchild Semiconductor has taken a leading role in the development of new package devices for Power MOSFETs. These developments were instrumental in improving thermal and electrical performance, as well as device footprint, or the board space area typically occupied by power devices. Today's technology offers a vast range of applications that can take advantage of these new packages. This paper will focus on desktop and notebook computers, cell phones, and PDAs. Detailed analysis will be placed on the thermal and electrical advantages of these packages; with emphasis on heat sinking and PCB layout ideas, providing an attractive alternative to the traditional packages used in designs where performance and space are of concern.