Quantum Leap Packaging announces industry breakthrough in plastic hermetic packaging

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Quantum Leap Packaging announces industry breakthrough in plastic hermetic packaging

机译：昆腾飞跃包装宣布塑料密封包装行业突破

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QUANTUM Leap Packaging,Inc.(QLP) a leading provider of high performance,air cavity packages for semiconductor assembly announced the availability of HermeTech~(TM),the industry's first hermetic plastic package that meets JEDEC standards.

机译：领先的高性能，半导体封装的气孔封装供应商昆腾飞跃包装有限公司（QLP）宣布推出HermeTech〜（TM），这是业界首个符合JEDEC标准的密封塑料封装。

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《Popular Plastics & Packaging》 |2007年第5期|共1页
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中图分类合成树脂与塑料工业;
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1. Quantum Leap Packaging announces industry breakthrough in plastic hermetic packaging [J] . Popular Plastics &, Packaging Group Popular Plastics & Packaging . 2007,第5期

机译：昆腾飞跃包装宣布塑料密封包装行业突破
2. Plastic Hermetic Packaging [J] . Inside R & D . 2007,第25期

机译：塑料密封包装
3. Reliability assessment of fielded plastic and hermetically packaged microelectronics [J] . Johnson B., Verma V. IEEE Transactions on Reliability . 1996,第1期

机译：现场塑料和密封微电子学的可靠性评估
4. QUANTUM LEAPS AND PARADIGM SHIFTS: NEW DEVELOPMENTS IN AND INNOVATIVE APPLICATIONS OF PLASTICS IN FLEXIBLE PACKAGING [C] . Gene Strupinsky Polymers, laminations coatings conference . 1996

机译：量子级联和范式转换：塑料在柔性包装中的新发展和创新应用
5. A study of selected failure mechanisms in a non-hermetic optoelectronic package [D] . Madduri, Sushma 2011

机译：非密封光电封装中选定故障机制的研究
6. Hermetically Packaged Microsensor for Quality Factor-Enhanced Photoacoustic Biosensing [O] . Imran Latif, Masaya Toda, Takahito Ono 2020

机译：密封封装的微传感器用于提高质量因子的光声生物传感
7. Quantum Leap packaging Mil-Spec LCP air cavity packages [O] . 2004

机译：Quantum Leap包装Mil-Spec LCP气腔包装

Quantum Leap Packaging announces industry breakthrough in plastic hermetic packaging

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