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DESIGN METHOD FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE DESIGN SYSTEM
DESIGN METHOD FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE DESIGN SYSTEM
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机译:半导体封装的设计方法及半导体封装设计系统
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摘要
A design method for a semiconductor package including a first chip, a second chip, a 2.5 dimensional (2.5D) interposer, a package substrate, and a board includes generating a layout including the 2.5D interposer on the package substrate and the first and second chips individually arranged on the 2.5D interposer, based on design information; analyzing signal integrity and power integrity between the first and second chips from the layout; analyzing signal integrity or power integrity between the first chip and at least one third chip on the board from the layout; and determining whether to modify the layout based on the analysis results.
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