首页> 外文会议>International Conference on Materials for Microelectronics; 20001016-20001017; Dublin; IE >GROWTH AND CHARACTERIZATION OF SHAPE MEMORY ALLOY THIN FILMS FOR Si M1CROACTUATOR TECHNOLOGIES
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GROWTH AND CHARACTERIZATION OF SHAPE MEMORY ALLOY THIN FILMS FOR Si M1CROACTUATOR TECHNOLOGIES

机译:Si M1致动器技术的形状记忆合金薄膜的生长和表征

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NiTi thin film alloys have been grown by sequential multilayer deposition of Ni and Ti pure layers followed by metal interdiffusion by annealing. Short time (5 min) annealing of the deposited layers at 500℃ leads to alloying of Ni and Ti, provided that preferential oxidation of Ti is avoided. This has been achieved by capping of the layers with AlN. This constitutes a very efficient barrier, which prevents any oxygen contamination of the film, even for long time annealing in conventional furnaces. The structure of the processed films strongly depends on the temperature and time of the thermal process, obtaining Ni and Ti rich phases when the films are annealed at higher temperatures and/or during longer times. As-grown and processed films are analysed by X-ray Diffraction, in-depth Auger Electron Spectroscopy and X-ray Photoelectron Spectroscopy techniques. The obtained data corroborate the interest of the studied processes for the grown of NiTi thin films for the development of microactuator devices in Si technology.
机译:通过依次多层沉积Ni和Ti纯层,然后通过退火使金属相互扩散,可以生长NiTi薄膜合金。如果避免避免钛的优先氧化,在500℃下短时间(5分钟)的退火会导致Ni和Ti合金化。这是通过用AlN覆盖层来实现的。这构成了非常有效的屏障,即使在常规炉中进行长时间退火,也可以防止薄膜中的氧气污染。加工过的薄膜的结构在很大程度上取决于热处理的温度和时间,当薄膜在较高的温度和/或较长的时间内退火时,会获得富Ni和Ti的相。通过X射线衍射,深度俄歇电子能谱和X射线光电子能谱技术分析已生长和加工过的薄膜。所获得的数据证实了所研究的工艺的兴趣,该工艺用于在Si技术中开发用于驱动微致动器的NiTi薄膜。

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