INVESTIGATION OF THE CUTTING PERFORMANCE OF LASER DRESSED METAL BONDED DIAMOND BLADES

摘要

Cutting of hard and brittle materials as SinteredSilicon Carbide SSiC is an obstacle for implementingSSIC into MEMS applications. Wear and accuracyloss of resin-bonded diamond blades are significant.In contrast, metal-bonded diamond blades have abetter shape accuracy during dicing of SSiC butrequire frequent dressing to renew the worn-outdiamond grains because these blades do not performself-dressing as resin-bonded blades. In comparisonto conventional dressing methods, laser dressing isapplicable while the cutting process is running. Inthis study, a pulsed laser (τ = 655 ps) has beenintegrated in a dicing machine to perform on machinelaser dressing. The sharpness after dressing isevaluated as the cutting edge surface roughness. Thedicing performance is evaluated by observing thedicing results in terms of cutting depth consistencyand by capturing the spindle power during dicing.Dicing blades which have been laser dressed with thepresence of coolant feature less sharpness than dicingblades which have been laser dressed in drycondition. The dicing results prove the sharpness anddurability of laser dressed dicing blades incomparison to new and conventionally dressedblades.