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Crystal Orientation and Hardness of Au/NiCr/Ta Films on Si-(111) Substrate Prepared by Magnetron Sputtering

机译:磁控溅射制备Si-(111)基体上Au / NiCr / Ta膜的晶体取向和硬度

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Au/NiCr/Ta soft multi-layered metal films were deposited on hard Si-(111) substrate by magnetron sputtering. The crystal orientation, Hardness (H) and Elastic modulus (E) were investigated as a function of substrate temperature by XRD and nanoindentation techniques. The XRD revealed that all films on Si-(111) substrate are Au-(111) preferred orientation, indicating there are no alloying phases in the films, which is different from Au/NiCr/Ta films on Al2O3 substrate with a mixture of Au-(111) and Au-(200) orientation. Nanoindentation tests at shallow indentation depths (h≤t/4) where the hardness is reliable for metal films on hard substrate. Au film at substrate temperature 200℃ has the highest hardness 4.2GPa. Meanwhile, the H/E value also indicated that the Au/NiCr/Ta films have preferable wear resistance at substrate temperature 200℃.
机译:通过磁控溅射在硬Si-(111)衬底上沉积Au / NiCr / Ta软多层金属膜。通过XRD和纳米压痕技术研究了晶体取向,硬度(H)和弹性模量(E)与衬底温度的关系。 X射线衍射表明,Si-(111)衬底上的所有膜均为Au-(111)择优取向,表明该膜中没有合金相,这不同于Al2O3衬底上的Au / NiCr / Ta膜与Au的混合物-(111)和Au-(200)方向。纳米压痕测试是在较浅的压痕深度(h≤t/ 4)处进行的,其中硬度对于硬质基材上的金属膜是可靠的。基材温度为200℃时,金膜的最高硬度为4.2GPa。同时,H / E值还表明Au / NiCr / Ta膜在200℃的基底温度下具有较好的耐磨性。

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