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TCAD simulation for low power UTBB FDSOI CMOS device

机译:低功耗UTBB FDSOI CMOS器件的TCAD仿真

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摘要

In this work a UTBB FDSOI model has been proposed by which leakage current is drastically reduced. Therefore it gives us freedom to scale down the device. Various comments on Sub-threshold slope (SS) and threshold voltage have been made. Effect of Buried Oxide (BOX) and Channel length variation has been described in terms of on-state current, off-state current, threshold voltage and SS. AC analysis of CMOS device has also been done by simulating the basic capacitance of proposed device. This model is highly appreciated for low power while using with multi threshold voltage.
机译:在这项工作中,已经提出了UTBB FDSOI模型,通过该模型可以大大降低泄漏电流。因此,它为我们提供了缩小设备尺寸的自由。关于亚阈值斜率(SS)和阈值电压已做出各种评论。掩埋氧化物(BOX)和沟道长度变化的影响已根据导通状态电流,截止状态电流,阈值电压和SS进行了描述。 CMOS器件的交流分析也通过模拟所提出器件的基本电容来完成。该模型因与多阈值电压一起使用时的低功耗而受到高度赞赏。

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