Micromachined LCP for packaging MEMS sensors

机译：用于封装MEMS传感器的微加工LCP

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Liquid crystal polymer (LCP) is a thermoplastic material with a variety of useful properties that can be exploited to yield new types of packaging for MEMS sensors. Although each type of MEMS sensor has unique packaging requirements, a commercial-off-the

机译：液晶聚合物（LCP）是一种热塑性材料，具有多种有用的特性，可用于生产MEMS传感器的新型封装。尽管每种类型的MEMS传感器都有独特的封装要求，但商业化的

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《Industrial Electronics IECON, 2005 - 31st Annual Conference of IEEE》|2005年|P.5|共1页
会议地点 Raleigh,NC
作者
Dean; R.; Pack; J.; Sanders; N.; Reiner; P.;
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bonding processes; claddings; copper; electronics packaging; gold compounds; humidity sensors; liquid crystal polymers; micromachining; microsensors; tin; AuSn; Cu; Cu cladding; Hygrometrix HMX2000; LCP substrate; MEMS sensor packaging; Sn; Sn coating; commercial-off-the-;

机译：键合过程；覆层铜;电子包装；金化合物；湿度传感器；液晶聚合物；微加工微传感器锡;金锡铜铜包层Hygrometrix HMX2000; LCP基材； MEMS传感器包装；锡;锡涂层；商业化;
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2. A flip-chip encapsulation method for packaging of MEMS actuators using surface micromachined polysilicon caps for BioMEMS applications [J] . Panchawagh HV, Faheem FF, Herrmann CF, Sensors and Actuators, A. Physical . 2007,第1期

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3. Reconfigurable RF MEMS Phased Array Antenna Integrated Within a Liquid Crystal Polymer (LCP) System-on-Package [J] . Kingsley N., Ponchak G. E., Papapolymerou J. IEEE Transactions on Antennas and Propagation . 2008,第1期

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4. Micromachined LCP for Packaging MEMS Sensors [C] . Robert Dean, Jeremiah Pack, Nicole Sanders, Annual Conference of the IEEE Industrial Electronics Society . 2005

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5. Fabrication and testing of micro vias in liquid crystal polymer (LCP) substrate for RF-MEMS packaging applications . [D] . Chowdhury, Mohammad Kamruzzaman. 2010

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6. Piezoresistive temperature sensors fabricated by a surface micromachining CMOS MEMS process [O] . Chunhua Cai, Junyan Tan, Di Hua, -1

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7. Silicon Micromachined Packages for RF MEMS Switches [O] . Margomenos Alexandros, Peroulis Dimitrios, Herrick Katherine J., 2001

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8. Micromachined sensor systems on a chip: The integration of MEMS with CMOS and its applications [R] . Smith, J. , Montague, S. , Sniegowski, J. 1997

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Micromachined LCP for packaging MEMS sensors

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