太赫兹真空器件中的微加工技术和微封装技术

摘要

As the operation frequency increases up to terahertz, the present technology of conventional machines like electrical discharge machining (EDM) allows a tolerance of over 5μm and a surface roughness of a few hundred to a few thousand nanometers, which are the primary obstacles confronted by high-power devices in millimeter and submillimeter wave region. To overcome the problems, there have been intensive efforts to employ microfabrication techniques such as LIGA, UV-LIGA and deep reactive ion etching (DRIE) in fabricating the circuits for millimeter and submillimeter wave vacuum electron devices. This pa per presents the process, characterization and application of three microfabrication techniques above men tionedand examples recent applications of the microfabrication techniques interahertzvacuum devices.%当工作频率升高至太赫兹频段时,真空器件的结构尺寸缩小至毫米级甚至微米级.传统的精密加工方法已经不能满足要求,这就要求采用新的加工技术即微细加工技术以保证很高的尺寸精度和表面光洁度.本文介绍了三种主要的微细加工技术,LIGA、UV(紫外)LIGA和深反应离子刻蚀,阐述了这三种加工技术的工艺流程、特点以及其应用情况,并举例说明各加工技术在太赫兹真空器件中的一些应用.