Micron Inc., Assembly RD, Boise, Idaho;
Department of Electrical Engineering, University of Idaho Email: fbarlow@uidaho.edu;
Power Electronics and Electric Machinery Research Center Oak Ridge National LaboratoryrnNational Transportation Research Center;
Power Electronics and Electric Machinery Research Center Oak Ridge National Laboratory National Transportation Research Center;
Power Electronics and Electric Machinery Research Center Oak Ridge National Laboratory National Transportation Research Center;
Power Electronics and Electric Machinery Research Center Oak Ridge National Laboratory National Transportation Research Center;
Department of Electrical Engineering, University of Idaho;
Power Electronics; SiC; High Temperature Packaging;
机译:可堆叠的SIC嵌入式陶瓷包,用于高压和高温电力电子应用
机译:具有高温双向N形负微分电阻的新型SiC / Si异质结二极管,适用于高温应用
机译:牵引电机应用的开创性高温绝缘系统
机译:用于HEV的高温SIC包装追踪
机译:SIC CMOS技术的高温应用内存模块设计
机译:一种改进的基于再生光纤布拉格光栅的含氢硼-锗共掺杂光敏光纤中的金属包装应变传感器用于高温应用
机译:HEV牵引应用的高温大功率封装技术
机译:HEV牵引应用的高温大功率封装技术