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Total-ionizing-dose radiation response of 32 nm partially and 45 nm fully-depleted SOI devices

机译:32 nm部分和45 nm完全耗尽SOI器件的总电离剂量辐射响应

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TID-induced changes in 32 nm PD SOI devices depend on the device variant: low VT devices show minor increased in leakage, high VT devices show negligible change. Simulated sensitivity of TID to the gate work function of the high-k metal gate and associated doping changes confirm that the body doping remains high and generally mitigates TID sensitivity. Preliminary ring oscillator measurements show no measurable change in supply current or frequency with TID. Specially designed experimental 45 nm SOI FDSOI devices exhibit a pronounced TID-induced VT shift due to the coupling with the BOX layer.
机译:TID引起的32 nm PD SOI器件的变化取决于器件的变型:低V T 器件的泄漏量略有增加,高V T 器件的变化可忽略不计。 TID对高k金属栅极的栅极功函数的模拟灵敏度以及相关的掺杂变化证实了本体掺杂仍然很高,通常可以降低TID灵敏度。初步的环形振荡器测量结果表明,TID不会使电源电流或频率发生可测量的变化。特别设计的实验性45 nm SOI FDSOI器件由于与BOX层耦合,因此表现出明显的TID诱导的V T 漂移。

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