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Effect of Active Layer Thickness on Device Performance and Hot Carrier Instability in Metal Induced Crystallized Polycrystalline Silicon Thin-Film Transistors

机译:有源层厚度对金属诱导的结晶多晶硅薄膜晶体管器件性能和热载流子不稳定性的影响

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摘要

In this paper, the effect of active layer (AC) thickness on the device performance and hot carrier (HC) instability of polycrystalline silicon (poly-Si) thin-film transistors (TFTs) based on metal induced crystallization (MIC) is investigated. The thinner AC thickness of MIC poly-Si TFTs brings better device performance and HC instability, which may be respectively attributed to the better gate control to the active channel and different electric field distributions in the active channel and gate oxide.
机译:本文研究了有源层(AC)厚度对基于金属诱导结晶(MIC)的多晶硅(poly-Si)薄膜晶体管(TFT)的器件性能和热载流子(HC)不稳定性的影响。 MIC多晶硅TFT的AC厚度更薄,带来了更好的器件性能和HC不稳定性,这可能分别归因于对有源沟道更好的栅极控制以及有源沟道和栅极氧化物中不同的电场分布。

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