Failure Analysis of Multi-layer Ceramic Capacitors under Board Level Shock Environment

摘要

The possible failure modes of the multi-layer ceramic capacitor (MLCC) under board-level shock environment are studied through modeling, simulation and experiment. In this work, a finite element model is established to simulate the stress distribution. A Machete hammer test system is set up to measure the shock resistance of MLCC. It is indicated that pad peeling off, fracture of metal electrodes and degradation of electrical parameters are the main failure phenomena of MLCC under board-level impact.