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Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors

机译:相关显微镜工作流程,用于多层陶瓷电容器的精确靶向故障分析

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摘要

The correlative framework includes three-dimensional X-ray tomography, femto-second laser micro machining, three-dimensional FIB/SEM/EDS tomography, and data segmentation. This framework is highly efficient allowing non-destructive locating of the defect and nanometer precise targeting with communication between instruments. The analyses resulted in a fully segmented three-dimensional data set revealing a failure mode of leakage due to suspended metal within the dielectric material.
机译:相关框架包括三维X射线断层扫描,毫微微第二激光微加工,三维FIB / SEM / EDS断层扫描和数据分割。该框架高效允许无损定位缺陷和纳米精确定位在仪器之间的沟通。分析导致完全分段的三维数据集,揭示由于介电材料内的悬浮金属引起的泄漏失效模式。

著录项

  • 来源
    《Microelectronics & Reliability》 |2020年第11期|113858.1-113858.6|共6页
  • 作者单位

    Univ Connecticut REFINE Lab 159 Discovery Dr Storrs CT 06250 USA;

    Univ Connecticut REFINE Lab 159 Discovery Dr Storrs CT 06250 USA;

    Univ Connecticut REFINE Lab 159 Discovery Dr Storrs CT 06250 USA;

    Univ Connecticut REFINE Lab 159 Discovery Dr Storrs CT 06250 USA;

    Univ Connecticut REFINE Lab 159 Discovery Dr Storrs CT 06250 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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