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Extraction and de-embedding of S-parameters using small-signal modeling for AlGaN/GaN HEMTs

机译:使用小信号建模对AlGaN / GaN HEMT进行S参数的提取和去嵌入

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At high frequency, various structures such as probe, pads and interconnect-metal lines affect the parameter measurement of HEMT device. To precisely measure the device intrinsic performance, it is required to de-embed these parasitic effects. In this paper, only two structures based de-embedding procedure is used to reach to the device plane. This paper shows difference between measured and extracted S-parameters based on Berroth and Meras model, with de-embedding and without de-embedding. In this paper we use fabricated AlGaN/GaN HEMT on SiC transistor of 0.8×100 μ m
机译:在高频下,各种结构(例如探针,焊盘和金属互连线)都会影响HEMT设备的参数测量。为了精确测量器件的固有性能,需要去嵌入这些寄生效应。在本文中,仅使用基于两个结构的去嵌入过程来到达设备平面。本文显示了基于Berroth和Meras模型的带去嵌入和不带去嵌入的S参数的测量值和提取值之间的差异。在本文中,我们在0.8×100μm的SiC晶体管上使用制造的AlGaN / GaN HEMT

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