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Effective conversion processes of metal-oxide precursors for the reduction of the conversion temperature in solution processed metal-oxide thin-film

机译:金属氧化物前体的有效转化过程,用于降低溶液加工的金属氧化物薄膜中的转化温度

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We report two different conversion pre-treatments of metal-oxide precursors used in metal-oxide thin-film transistors with the goal to reduce the conversion temperature of the precursors for the use on flexible substrates. On the one hand we used an oxygen plasma treatment prior to the thermal conversion to reduce the oxygen vacancies and the hydrocarbon content and on the other hand an UV laser annealing is used allowing annealing and structuring in one process step. For the O2 plasma treated transistors we achieved a field-effect mobility of muFE ≈ 4.8 cm(exp 2)V(exp -1)s(exp -1), an on/off ratio of 10(exp 7) and a Vth = 2.5 V at a conversion temperature of 300 deg C. Laser converted transistors prepared at a maximum processing temperature as low as 150 deg C show a field-effect mobility of muFE = 0.9 cm(exp 2)V(exp -1)s(exp -1) and a threshold voltage of Vth = -23 V.
机译:我们报告了用于金属氧化物薄膜晶体管的金属氧化物前体的两种不同的转化预处理,目的是降低用于柔性基板上的前体的转化温度。一方面,我们在热转化之前使用了氧等离子体处理,以减少氧空位和碳氢化合物的含量;另一方面,使用了UV激光退火,可以在一个处理步骤中进行退火和结构化。对于O2等离子体处理的晶体管,我们获得了muFE≈4.8 cm(exp 2)V(exp -1)s(exp -1)的场效应迁移率,开/关比10(exp 7)和Vth =在300摄氏度的转换温度下为2.5 V.在低至150摄氏度的最大加工温度下制备的激光转换晶体管显示的场效应迁移率为muFE = 0.9 cm(exp 2)V(exp -1)s(exp -1)和阈值电压Vth = -23 V.

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