Dept. of Mater. Sci. Eng., Korea Adv. Inst. of Sci. Technol., Daejon;
ball grid arrays; copper; dielectric materials; encapsulation; etching; resists; solders; wetting; Cu; bumpless ball grid array package; copper plate warpage; dielectric material wettability; encapsulation material; epoxy-based photo-patternable solder resist; flattening force; package fabrication; plasma treatment; resist film lamination; solder resist cavity; solder resist surface etching;
机译:最优等效焊球对叠片式球栅阵列疲劳可靠性的封装参数分析
机译:盖材料对热增强倒装芯片塑料球栅阵列封装焊球可靠性的影响
机译:芯片数量对用于引线键合堆叠式芯片球栅阵列封装的焊球可靠性的影响
机译:使用阻焊腔的浮肿球栅阵列(BBGA)包装
机译:用共晶铅锡和无铅焊料对塑料球栅阵列,芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
机译:类似于球栅阵列的64针纳米线表面紧固件用于室温电连接
机译:在Sn-3.8Ag-0.7Cu和Sn-20英寸-2Ag-0.5Cu焊球栅格的回流和老化期间形成的金属间化合物在SN-3.8AG-0.7CU和SN-20IN-2AG-0.5CU焊球栅格阵列套件