Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, 10617, Taiwan, R. O. C;
Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, 10617, Taiwan, R. O. C;
Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, 10617, Taiwan, R. O. C;
Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, 10617, Taiwan, R. O. C;
National Nano Device Laboratories, Hsin-Chu, 30078, Taiwan, R. O. C;
Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, 10617, Taiwan, R. O. C;
Annealing; Resistance; Films; Phosphorus; Implants; Germanium; Electron devices;
机译:微波退火,用于磷注入的MOSFET器件中掺杂剂激活的低热预算工艺
机译:通过快速热退火和闪光灯退火,硼在绝缘体中和应变硅上的活化和扩散
机译:350℃微波退火超浅结n-MOS激活锗中磷掺杂的研究
机译:快速热退火和微波退火应变和松弛GEN中磷的高掺杂剂活化
机译:在快速辅助快速热退火过程中,硼的活化和扩散会改变硅的初始工艺条件。
机译:通过硅烷化合物改性和快速热退火处理化学镀镍磷膜在硅片上的附着力
机译:通过快速热退火和闪光灯退火使硅和绝缘子上的硅中的硼活化和扩散
机译:In(x)Ga(1-x)as / Gaas应变层超晶格中的快速热退火效应。