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Low Temperature GaN Epitaxy Using Ga(mDTC)_3 Precursor

机译:Ga(mDTC)_3前驱体的低温GaN外延

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GaN thin film growth using vapor-phase epitaxy is a well-studied process that typically requires growth temperatures in the range of 950~1000 ℃. Tris(N,N-dimethyldithiocarbamato)-gallium(III) (Ga(mDTC)_3) was investigated in this study, a new precursor material for the GaN film deposition by hot-wall VPE technique, in an effort to reduce the growth temperature. TMGa, HC1 and NH3 were used as gas source precursors. Parametric growth studies were performed to optimize the growth temperature and the distance between the gas outlet and the substrate (z-position) using this process. The optimal growth temperature was found to be 850 ℃, and the optimal z-position was determined to be in the range of 12.5 to 15 cm. XRD studies showed that this growth method produces high-crystalline GaN thin films at relatively lower deposition temperature compared to existing growth techniques.
机译:气相外延生长GaN薄膜是一个经过充分研究的过程,通常需要在950〜1000℃范围内进行生长。研究了三(N,N,N-二甲基二硫代氨基甲酸酯)-镓(III)(Ga(mDTC)_3),这是一种通过热壁VPE技术沉积GaN膜的新型前驱材料,旨在降低生长温度。 TMGa,HCl和NH3用作气源前体。使用此过程进行了参数化生长研究,以优化生长温度和气体出口与基材之间的距离(z位置)。最佳生长温度为850℃,最佳z位置确定为12.5至15 cm。 XRD研究表明,与现有的生长技术相比,这种生长方法可在相对较低的沉积温度下生产出高结晶度的GaN薄膜。

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