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LOW TEMPERATURE EPITAXY OF A SEMICONDUCTOR ALLOY INCLUDING SILICON AND GERMANIUM EMPLOYING A HIGH ORDER SILANE PRECURSOR
LOW TEMPERATURE EPITAXY OF A SEMICONDUCTOR ALLOY INCLUDING SILICON AND GERMANIUM EMPLOYING A HIGH ORDER SILANE PRECURSOR
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机译:高阶硅烷前体的半导体合金(包括硅和锗)的低温回生
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摘要
A high order silane having a formula of SinH2n+2, in which n is an integer greater than 3, in combination with a germanium precursor gas is employed to deposit an epitaxial semiconductor alloy material including at least silicon and germanium on a single crystalline surface. The germanium precursor gas effectively reduces the gas phase reaction of the high order silane, thereby improving the thickness uniformity of the deposited epitaxial semiconductor alloy material. The combination of the high order silane and the germanium precursor gas provides a high deposition rate in the Frank-van der Merwe growth mode for deposition of a single crystalline semiconductor alloy material.
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机译:分子式为Si n Sub> H 2n + 2 Sub>的高阶硅烷与锗前体气体结合使用,其中n为大于3的整数一种在单晶表面上至少包括硅和锗的外延半导体合金材料。锗前驱物气体有效地减少了高级硅烷的气相反应,从而提高了沉积的外延半导体合金材料的厚度均匀性。高阶硅烷和锗前驱物气体的组合以Frank-van der Merwe生长模式提供了高沉积速率,用于沉积单晶半导体合金材料。
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