首页> 外文会议>Defect recognition and image processing in semiconductors 1995 >A New Method for Measuring Mobile Charge in SiO_2 on Si; The First Real-Time Wafer Mapping Capability
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A New Method for Measuring Mobile Charge in SiO_2 on Si; The First Real-Time Wafer Mapping Capability

机译:一种测量Si上SiO_2中移动电荷的新方法;首个实时晶圆映射功能

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摘要

We demonstrate, for the first time, whole-wafer mapping of the mobile charge in SiO_2 on silicon. The technique uses no test structure. The measurement is done in non-contact mode in a total time of about 20 minutes per wafer. Determination of the mobile charge is based on monitoring the ion drift by measuring corresponding changes in the contact potential difference. The drift is induced by corona charge on the entire SiO_2 surface.
机译:我们首次展示了硅上SiO_2中移动电荷的全晶片映射。该技术不使用任何测试结构。以非接触模式进行测量,每个晶片的总时间约为20分钟。移动电荷的确定是基于通过测量接触电势差的相应变化来监视离子漂移。漂移是由整个SiO_2表面上的电晕电荷引起的。

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