首页> 外文会议>Conference on Reliability, Testing, and Characterization of MEMS/MOEMS III; Jan 26-28, 2004; San Jose, California, USA >The Temperature Compensation of the Silicon Piezo-Resistive Pressure Sensor Using the Half-Bridge Technique
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The Temperature Compensation of the Silicon Piezo-Resistive Pressure Sensor Using the Half-Bridge Technique

机译:使用半桥技术的硅压阻式压力传感器的温度补偿

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摘要

The major factor affecting the high performance applications of the piezoresistive pressure sensor is the temperature dependence of its pressure characteristics. The influence due to temperature variation is manifested as a change in the span, bridge resistance, and offset of the sensor. In order to reduce the thermal drifts of the offset and span of the piezoresistive pressure sensor, a Half-Bridge-Compensating (HBC) technique is presented in this paper. There are many advantages such as the temperature compensation of the sensor (typically lower than 1%), and a simple and low cost application circuit. The theoretical analysis and experimental results show that both the output voltage and zero offset drift are much improved by the first-order HBC technique. The experimental results are matched to our theoretical analysis.
机译:影响压阻式压力传感器高性能应用的主要因素是其压力特性的温度依赖性。温度变化引起的影响表现为跨度,电桥电阻和传感器偏移的变化。为了减少压阻式压力传感器的偏移和跨度的热漂移,本文提出了一种半桥补偿(HBC)技术。有许多优点,例如传感器的温度补偿(通常低于1%)以及简单且低成本的应用电路。理论分析和实验结果表明,采用一阶HBC技术可大大改善输出电压和零偏移漂移。实验结果与我们的理论分析相符。

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