首页> 外文会议>Conference on Micro- and Nanoelectronics; 20031006-20031010; Zvenigorod; RU >Initiated tunnel current through thin gate oxide generation of minority carriers in Si-MIS-structures
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Initiated tunnel current through thin gate oxide generation of minority carriers in Si-MIS-structures

机译:通过Si-MIS结构中少数载流子的薄栅极氧化物生成而引发的隧道电流

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The nanometer scaling of metal-oxide-semiconductor (MOS)-devices requires a transition to thin and ultrathin gate insulators. Their tunneling conductance in such insulators essentially changes of the process of the minority carrier (MC) generation. In n-Si-MOS-structures with a insulator thickness below 100A the tightly growth and sharply dropping peak is appeared on the time dependence of the generation current I_g(t). The peak is completed a transition of a MOS-structure to the equilibrium inversion state In this state the stationary tunnel current I_(t∞) flows through a MOS-structure. The amplitude peak and its position in the time strongly depend from the structure construction, its prior history and external factors and can to change in wide limits. The sequential description of phenomenon is based on presentations about a impact ionization of the MC band, tunneled through oxide in semiconductor by heat electrons. The developed algorithm allows to divide of the contributions of generation and tunnel current component in dependences I(t, V_g) and to characterize of oxide tunnel conductance. The algorithm too allows to determine set of base electronic characteristics of MOS-structures: the impact ionization coefficient α, sign and integral density of fixed charge in a oxide, a rate of the MC generation and a velocity of the surface recombination, and the time evolution of the semiconductor surface potential. These data are base for the physical diagnostic of degradation mechanisms of the semiconductor/insulator interface region. The strong dependence of kinetics of the thermo-tunnel generation of MC from a composition of a surrounding medium can to use for a creation of gas sensors of new type.
机译:金属氧化物半导体(MOS)器件的纳米级缩放要求过渡到薄而超薄的栅极绝缘体。它们在此类绝缘体中的隧穿电导实质上改变了少数载流子(MC)生成过程。在绝缘体厚度小于100A的n-Si-MOS结构中,紧密依赖于产生电流I_g(t)的时间增长而出现急剧下降的峰值。峰值完成,从MOS结构过渡到平衡反转状态。在此状态下,固定隧道电流I_(t∞)流过MOS结构。振幅峰值及其在时间上的位置在很大程度上取决于结构构造,其先验历史和外部因素,并且可以在较大范围内变化。现象的顺序描述是基于有关MC带的碰撞电离的描述的,该MC带通过热电子隧穿半导体中的氧化物。所开发的算法允许根据I(t,V_g)来划分发电和隧道电流分量的贡献,并表征氧化物隧道电导。该算法还允许确定MOS结构的基本电子特性集:碰撞电离系数α,氧化物中固定电荷的符号和积分密度,MC生成的速率和表面重组的速度以及时间半导体表面电位的演变。这些数据是对半导体/绝缘体界面区域退化机理进行物理诊断的基础。 MC的热通道产生的动力学对周围介质组成的强烈依赖性可用于创建新型气体传感器。

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