首页> 外文会议>Conference on Light-Emitting Diodes: Research, Manufacturing, and Applications VIII; 20040127-20040128; San Jose,CA; US >Beyond the Limitations of Today's LED Packages: Optimizing High Brightness LED Performance by a Comprehensive Systems Design Approach
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Beyond the Limitations of Today's LED Packages: Optimizing High Brightness LED Performance by a Comprehensive Systems Design Approach

机译:超越当今LED封装的局限性:通过全面的系统设计方法优化高亮度LED性能

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摘要

Critical requirements including high brightness, high color rendering, and high wall plug efficiency for the most demanding LED applications such as surgical illumination and industrial and dental sealant curing are difficult to meet with the limitations posed by commercially available LED packages. The importance of optimizing an illumination system from the system-level perspective is presented. It is necessary to integrate efficient die, electrical drive conditions, heat dissipation, LED out-coupling optics and auxiliary optics. It is not sufficient to collect the maximum amount of light from an LED package; the light must be captured into a minimum aperture while maintaining maximal brightness. Commercially available LED packages, including the recently available 1 and 5 Watt emitters, suffer by varying degrees, in their applicability to today's most demanding applications. An optimized LED package is described that outperforms commercially available packages. Specific medical, commercial and industrial LED applications are described that can meet many of the most demanding requirements with today's technology.
机译:对于最苛刻的LED应用(例如手术照明以及工业和牙科密封胶固化),包括高亮度,高显色性和高壁塞效率的关键要求很难满足市售LED封装所带来的限制。提出了从系统级角度优化照明系统的重要性。必须集成高效的芯片,电气驱动条件,散热,LED输出耦合光学器件和辅助光学器件。仅从LED封装中收集最大的光量是不够的。必须在保持最大亮度的同时将光捕获到最小光圈中。市售的LED封装,包括最近可用的1和5瓦发射器,在适用于当今最苛刻的应用方面受到不同程度的影响。描述了一种优化的LED封装,其性能优于市售封装。描述了可以满足当今技术最苛刻要求的特定医疗,商业和工业LED应用。

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