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Beyond the Limitations of Today's LED Packages: Optimizing High Brightness LED Performance by a Comprehensive Systems Design Approach

机译:超出当今LED套餐的局限性:通过全面的系统设计方法优化高亮度LED性能

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Critical requirements including high brightness, high color rendering, and high wall plug efficiency for the most demanding LED applications such as surgical illumination and industrial and dental sealant curing are difficult to meet with the limitations posed by commercially available LED packages. The importance of optimizing an illumination system from the system-level perspective is presented. It is necessary to integrate efficient die, electrical drive conditions, heat dissipation, LED out-coupling optics and auxiliary optics. It is not sufficient to collect the maximum amount of light from an LED package; the light must be captured into a minimum aperture while maintaining maximal brightness. Commercially available LED packages, including the recently available 1 and 5 Watt emitters, suffer by varying degrees, in their applicability to today's most demanding applications. An optimized LED package is described that outperforms commercially available packages. Specific medical, commercial and industrial LED applications are described that can meet many of the most demanding requirements with today's technology.
机译:难以满足由商业上可获得的LED封装所带来的限制,包括高亮度,高色渲染和最苛刻的LED应用的高亮度,高色渲染和高壁插头效率的关键要求。提出了从系统级透视中优化照明系统的重要性。有必要集成有效的模具,电动驱动条件,散热,LED外耦合光学和辅助光学器件。收集来自LED封装的最大光量不足;必须在保持最大亮度的同时捕获光以最小孔径。可商购的LED封装,包括最近可用的1和5瓦的发射器,在其适用于今天最苛刻的应用程序中,受到不同程度的影响。描述了优化的LED封装,其优于商业上可用的包装。描述了具体的医疗,商业和工业LED应用,可以满足与当今的技术满足许多最苛刻的要求。

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