首页> 外文会议>Computers and Communications, 2005. ISCC 2005. >Tunable oxide-bypassed VDMOS (OBVDMOS): breaking the silicon limit for the second generation
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Tunable oxide-bypassed VDMOS (OBVDMOS): breaking the silicon limit for the second generation

机译:可调节的绕过氧化物的VDMOS(OBVDMOS):突破了第二代的硅极限

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The research effort to lower the on-state resistance for high voltage MOSFET devices continues. We have recently reported a novel device structure termed oxide-bypassed VDMOS (OBVDMOS) that utilized the well-established oxide thickness control instead of the difficult doping control in translating the on-resistance (Ron) - blocking voltage (BVdss) tradeoff limit beyond the conventional MOSFET silicon limit. Further enhancement on both breakdown voltage and on-resistance can be achieved by applying an external bias to the poly contact of the device. Moreover, this bias provides an independent control of adjusting breakdown voltage if it does not meet specifications due to foundry process variations.
机译:降低高压MOSFET器件的导通状态电阻的研究工作仍在继续。我们最近报道了一种称为氧化物旁路VDMOS(OBVDMOS)的新型器件结构,该器件结构在转换导通电阻(R on )的过程中利用了完善的氧化物厚度控制,而不是困难的掺杂控制电压(BV dss )的折衷限制超出了常规MOSFET硅限制。通过向器件的多触点施加外部偏置,可以进一步提高击穿电压和导通电阻。此外,如果由于铸造工艺的变化而无法满足规范要求,则该偏置可提供独立的控制来调节击穿电压。

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