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Silicon based system-in-package: a passive integration technology combined with advanced packaging and system based design tools to allow a breakthrough in miniaturization

机译：基于硅的系统级封装：一种无源集成技术，结合了先进的封装和基于系统的设计工具，可实现小型化的突破

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The very large development of home and domestic electronic appliances as well as portable device has led the microelectronics industry to evolve in two complimentary directions: 'More Moore' with the continuous race towards extremely small dimensions hen

机译：家用和家用电子设备以及便携式设备的飞速发展导致微电子行业朝着两个互补的方向发展：“ More Moore”与极小尺寸的母鸡不断竞争。

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来源
《Bipolar/BiCMOS Circuits and Technology Meeting - BCTM, 2005 IEEE》|2005年|P.169-173|共5页
会议地点 Santa BarbaraCA
作者
Murray; F.;
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elemental semiconductors; integrated circuit design; integrated circuit interconnections; integrated circuit testing; silicon; system-in-package; system-on-chip; IC design development tools; Si; advanced packaging; energy management; integrated circuit design; integ;

机译：元素半导体集成电路设计；集成电路互连；集成电路测试；硅;封装系统；片上系统； IC设计开发工具； ;高级包装；能源管理;集成电路设计；完整;

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专利

1. Passive and heterogeneous integration towards a Si-based System-in-Package concept [J] . F. Roozeboom, A.L.A.M. Kemmeren, J.F.C. Verhoeven, Thin Solid Films . 2006,第1a2期

机译：对基于Si的系统级封装概念的被动和异构集成
2. System-in-package integration of passives using $ 3D through-silicon vias [J] . F. Roozeboom, W. Dekkers, Y. Lamy, Solid state technology . 2008,第5期

机译：使用$ 3D硅通孔的无源器件的系统级封装集成
3. 3D system-in-package design using stacked silicon submount technology [J] . Dong Mingzhi, Santagata Fabio, Sokolovskij Robert, Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe . 2015,第2期

机译：使用堆叠式硅基板技术的3D封装系统设计
4. Silicon based system-in-package: a passive integration technology combined with advanced packaging and system based design tools to allow a breakthrough in miniaturization [C] . Murray, F. . 2005

机译：基于硅的系统级封装：无源集成技术与先进的封装和基于系统的设计工具相结合，可实现小型化的突破
5. Design and implementation of high-Q passive devices for wireless applications using system-on-package (SOP) based organic technologies. [D] . Dalmia, Sidharth S. 2002

机译：使用基于系统级封装（SOP）的有机技术为无线应用设计和实现高Q无源设备。
6. On-Chip Miniaturized Bandpass Filter Using GaAs-Based Integrated Passive Device Technology For L-Band Application [O] . Bao-Hua Zhu, Nam-Young Kim, Zhi-Ji Wang, 2019

机译：基于GaAs的集成无源器件技术的片上微型带通滤波器用于L波段应用
7. LTCC-Based System-in-Package (SiP) Technology for Microwave System Integration [O] . Young Chul Lee 2017

机译：基于LTCC的系统内部（SIP）技术，用于微波系统集成
8. Design of Advanced Fossil-Fuel Systems (DAFFS): A Study of Three Developing Technologies for Coal-Fired, Base-Load Electric Power Generation. Integrated Coal-Gasification/Combined Power Plant with BGC/Lurgi Gasification Process [R] . Ackerman, A. D., Cox, M. K., Schuck, L. J., 1983

机译：先进化石燃料系统（DaFFs）的设计 - 燃煤，基荷电力三大开发技术研究。综合煤气化/联合发电厂与BGC /鲁奇气化工艺

Silicon based system-in-package: a passive integration technology combined with advanced packaging and system based design tools to allow a breakthrough in miniaturization

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