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Yield Improvement of MESFET Circuits with Idd Ring-Like Pattern

机译:具有奇数环形图案的MESFET电路的良率提高

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摘要

Diesort yield loss caused by bias current Idd out of specification limits showing a ring-like pattern in our major MESFET products was investigated in this paper. Process splits and DOE were used to identify the root cause of Idd ring-like pattern. It was found that the Idd ring-like pattern was caused by gate gold plating process. The higher plating current density interacting with anode diffuser ring in the plating system resulted in higher stress at the boundary layer in the filter holes. Hence, the stress-induced piezoelectric effect caused Idd shifts to low at these areas.
机译:本文研究了由偏置电流Idd超出规格限制而引起的Diesort良率损失,在我们的主要MESFET产品中显示出环形图案。使用过程拆分和DOE来识别Idd环状模式的根本原因。已经发现,Idd环状图案是由栅极镀金过程引起的。在电镀系统中,较高的电镀电流密度与阳极扩散环相互作用,导致在过滤孔边界层处产生较高的应力。因此,应力诱发的压电效应导致这些区域的Idd偏移降低。

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